National Technical Forums: A Packaging & Processing Week Event
Run alongside AUSPACK, the 2017 National Technical Forums are designed to deliver a three-day educational program that will cover a broad range of topics relating to the theme Innovation & Design.
The 2017 Packaging & Processing Week National Technical Forums will attract delegates from all facets of the packaging and processing industry of both technologist and management levels (such as design, development, marketing, production, engineering, supply chain and logistics personnel) to equipment suppliers, raw material providers, users of packaging, retailers and consumers.
The AIP and the APPMA intend to break the National Technical Forums into breakout sessions, to ensure that a diverse range of issues and topics are covered over the three days. The AIP and the APPMA are looking for a broad range of speakers from all areas of the packaging, processing, materials and components sectors to ensure that the National Technical Forums offer something for everyone.
