2019 AIP National Technical Forum

Venue: SOFITEL Wentworth
Location: Sydney, New South Wales
30 Apr, 2019
Web: http://aipack.com.au/event-registration/?ee=190

The Australian Institute of Packaging (AIP) is pleased to advise that the biennial National Technical Forum is moving alongside the annual Australasian Packaging Innovation & Design (PIDA) Awards for Australia and New Zealand. Having served the industry for over two decades the AIP National Technical Forum brings together packaging technologists, designers, sales and marketing people from all industries to better understand the technical side of packaging design.

The 2019 AIP National Technical Forum will be designed to focus on showcasing best-practice and award-winning Save Food & Sustainable Packaging Designs and Innovative packaging across Food, Beverage, Pharmaceutical and Domestic Household. This educational event will allow attendees the opportunity to be inspired by what other companies are already developing in key industries and markets. Walk away with new ideas and inspiration for your next packaging project.

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